Cooling
We offer complete engineering for each of these solutions: Water cooling plates, heat exchangers, heat pipes (systems), high-performance heat sinks and extruded profiles.
NEW: NEOcore technology
NEOcore technology is a two-phase cooling technology designed to minimise the temperature difference between the top and bottom of the heat sink while simultaneously reducing the Delta T between the heat source and the environment.
NEOcore improves the heat conductivity of aluminium by up to 1000 times.
AURORA
AURORA is a high-performance, all-aluminium heat sink platform that combines the highest production volume of aluminium extrusion, cost advantages and NEOcore phase change technology.
ULTIMA
High-performance – ULTIMA supports power levels of up to several kilowatts per module with superior efficiency thanks to its large evaporator and optimised fin structure. Lightweight – ULTIMA's construction from aluminium tubes and sheet metal fins makes it light and easy to integrate into end products.
Liquid cooling plates
Liquid cooling plates are the most efficient cooling solutions. Here, water or another cooling liquid is led as directly as possible past the heat source.
Heatsinks
From stamped heat sinks for low power on the PCB to extruded profiles, high performance heat sinks and mounted heat sinks with pressed-in fins.
Vapor chambers
Take large amounts of heat and dissipate it quickly and distribute it from a hotspot to a large area. The optimal solution for confined and limited areas. Directly with heat sink optimized for your device.
Heat exchanger
MB Electronic offers you highly efficient water-air heat exchangers from Thermatron. Due to the design of the fins and the extremely narrow bending radii of the tubes, these heat exchangers achieve the highest efficiency on the market.